Main Equipment
PCBA Equipments
- SMT High Speed mounting machine, capable of mounting 01005 passive components.
- Reflow, Wave Soldering, DIP Auto Soldering Machine
- Max. PCB size for production is 510*460mm
- Lead-Free manufacturing
- Automatic Coating / Spray Coating
- Router
- IC Programming
High Speed Mounter
Reflow - ERSA HOTFLOW 3/20
N2 Wave Solder - ERSA PowerflowZH
Automatic Coating - Nordson SL-940
IC Programming - Dediprog DP1000-G3
Inspection & Testing Equipments
- SPI (in-line)
- 3D AOI (in-line)
- 3D X-Ray
- DIP AOI (in-line)
- ICT
- Function Test
SPI - TRI TR7007 SII
3D AOI - TRI TR7700Q SII
3D X-Ray - YXLON Cheetah-EVO-SMT
DIP AOI - LANDRAX PCI-770-M
ICT - Keysight 3070
ICT - TRI TR-518 SII
Production Traceability / Recording System
- Smart Material Rack (Error proofing / FIFO)
- MES (Manufacturing Execution System)
- Replenish Component Control
- i-Repair Alarm System